While the CFD simulation world continues to largely adopt as many tools into their workflow as necessary to come to a truly accurate solution, we contend that having a singular solution is preferable. Enter Fidelity CFD: the all-in-one CFD platform. Your workflow involves geometry import and preparation, meshing, process resource management, data monitoring and analysis, and the solving capabilities you’ve come to know and love. The Fidelity CFD environment offers all of this and more.

With a highly automated, customizable GUI, you can choose the iterative workflow you need to solve your modeling and simulation challenges with the desired speed and fidelity. With accuracy becoming more imperative, the benefit of not having to switch between environments can mean greater ease and speed to implement the high-fidelity simulations your systems need by reducing the file import process. Increase individual and team productivity with the Fidelity CFD environment.

Cadence Palladium and Protium systems are relied upon for the most advanced, mission-critical applications. These systems enable the highest throughput pre-silicon hardware debug and pre-silicon software validation, helping to bring products to market faster. They are used on the industry's largest multi-billion-gate SoC designs offering the fastest performance and design bring-up to help shorten the overall time to market.

To meet the high-performance and reduced footprint requirements for multi-mode/multi-band handsets, wireless smart devices, and aerospace systems, companies are differentiating themselves by developing best-in-class RF/microwave IP. Whether these products are MMIC-based or tightly integrated into a PCB and/or multi-functional module, designers of RF/microwave front-end electronics require specialized design and simulation capabilities to meet aggressive performance targets.

RF/microwave devices are defined by unique performance metrics, impacted by operating conditions, such as frequency, input power, bias and modulation waveform, temperature, and terminal impedances. In addition to operating conditions, performance is largely driven by the physical layout of the design itself, requiring a tight coupling between electrical and physical design.

Our RF/microwave design tools, such as the Cadence AWR Design Environment platform, AWR Microwave Office software, AWR Visual System Simulator (VSS) communications and radar systems design software, AWR AXIEM 3D Planar EM Analysis, and AWR Analyst 3D FEM EM analysis, address these challenges with electrical/physical co-design through RF-aware device models, electromagnetic (EM) analysis along with specialized circuit simulation technology, and design support aids. RF product development also may require system-level analysis to simulate the behavior within a radar and communications link.

AWR Design Environment platform – Design platform provides RF/microwave engineers with integrated high-frequency circuit, system, and EM simulation technologies and design automation to develop physically realizable electronics ready for manufacturing

AWR Microwave Office software – Circuit design software with intuitive interface, innovative design automation, and powerful harmonic-balance circuit simulation ensure greater engineering productivity and accelerated design cycles

AWR VSS software – RF/wireless communications and radar system design software supports VSWR-aware modeling of RF and DSP blocks, providing time-domain, frequency-domain, and circuit-envelope analyses
AWR AXIEM analysis – 3D planar method-of-moments (MoM) EM analysis simulator addresses passive structures, transmission lines, large planar antennas, and patch arrays. AWR AXIEM analysis delivers the accuracy, capacity, and speed designers need to characterize and optimize passive components on RF PCBs, modules, LTCCs, MMICs, RFICs, and antennas

AWR Analyst software – 3D finite-element method (FEM) EM simulation and analysis software accelerates high-frequency product development from early physical design characterization through to full 3DEM verification. The advanced solver technology provides fast and accurate analysis of the 3D structures/interconnects found in today's complex high-frequency electronics

AWR What's New – Offers new and enhanced technologies that provide greater design efficiency and first-pass success to engineering teams developing or integrating III-V ICs, multi-technology modules, and PCB assemblies for 5G, automotive, and aerospace/defense applications

The 112G-ELR SerDes delivers exceptional extended long-reach performance with superior margin, optimized power and area that is ideal for the next-generation cloud networking, artificial intelligence and machine learning (AI/ML), and 5G wireless applications. The SerDes PHY IP supports PAM4 and NRZ signaling and data rates from 1G to 112G and incorporates industry-leading analog-to-digital converter (ADC), clock-data-recovery (CDR), and digital signal process (DSP) technology with maximum likelihood sequence detector (MLSD) that enables the support of up to 45dB channel.